Dissimilar joining of alumina to aluminum at room temperature without applying a loading by two-step deposition

نویسندگان

چکیده

Abstract Low temperature joining is desirable for aluminum-ceramics because aluminum has a large coefficient of thermal expansion. In the present work, Al2O3 to Al was performed at room by two-step deposition method including Ni electroless and Cu electrodeposition. The strength increased, fracture mode changed from Ni/Al2O3 interface that in substrate using porous or etching dense surface. Thus, work demonstrates are successfully joined without applying load method.

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ژورنال

عنوان ژورنال: Materials Letters

سال: 2021

ISSN: ['1873-4979', '0167-577X']

DOI: https://doi.org/10.1016/j.matlet.2020.129245